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Build

SEC:BUILD // MFG:CALPAK-USA

BUILD

High-quality manufacturing and assembly from prototype to production.

Why Manufacturers Trust Calpak

Built for Production

Calpak USA is a full-service electronics manufacturer delivering everything from single prototype boards to high-volume production runs exceeding 10 million units per year. Our Hawthorne, California facility houses complete PCB assembly lines, wire harness manufacturing, bare board fabrication, and systems integration — all under one roof with unified quality control.

"Prototype today, production tomorrow — same facility, same quality system, same team."

Our manufacturing capabilities span SMT assembly, through-hole insertion, mixed technology, wire harness fabrication, PCB fabrication, and enclosure assembly. Whether you need a quick-turn prototype to validate your design or a scaled production run with full turnkey procurement, Calpak manages the entire process from component sourcing through final inspection and shipping.

With 40+ years of manufacturing experience, AS9100 Rev. D and ISO 9001 certifications, ITAR registration, and ANSI/ESD S20.20 compliance, our quality standards meet the requirements of aerospace, defense, medical device, and commercial customers alike.

Assembly Capabilities

SMT & Through-Hole Specifications

Our Hawthorne facility operates high-speed SMT placement lines capable of placing components down to 01005 (0.4 mm × 0.2 mm) package sizes, fine-pitch QFPs to 0.4 mm lead pitch, and BGAs with ball pitches as small as 0.5 mm. Solder paste application uses precision laser-cut stainless steel stencils with aperture ratios optimized per IPC-7525 guidelines for each component footprint. Reflow soldering is performed in nitrogen-atmosphere convection ovens with full thermal profiling per IPC/JEDEC J-STD-020 to protect moisture-sensitive components.

Through-hole assembly includes both manual soldering by IPC-certified operators and selective wave soldering for mixed-technology boards. We process both leaded (Sn63/Pb37) and lead-free (SAC305) solder alloys, supporting RoHS-compliant and ITAR/defense programs that require tin-lead processing. All soldering operations comply with J-STD-001 Class 2 and Class 3 workmanship standards.

Quality Assurance

Inspection & Test Process

Every assembly at Calpak USA passes through a multi-stage inspection process designed to catch defects before they leave our facility. Post-reflow boards undergo automated optical inspection (AOI) to verify component placement, solder joint formation, and polarity. BGA and bottom-terminated components are inspected with X-ray imaging to evaluate solder ball voiding, bridging, and head-in-pillow defects that are invisible to optical systems.

Functional testing is performed using custom test fixtures designed and fabricated in-house, as well as flying probe and in-circuit test (ICT) equipment. For aerospace and defense programs, all inspection and test results are documented with full lot traceability per AS9100 Rev. D requirements, including solder paste lot numbers, reflow profile records, and operator certifications. Our first-pass yield rate consistently exceeds 99.5% across both prototype and production builds.

Scalable Production

Volume Capabilities & Lead Times

Calpak USA supports production volumes from a single prototype board through runs exceeding 10 million units per year. Quick-turn prototype assembly starts at 5 business days for consigned builds, with turnkey prototypes typically shipping in 2 to 3 weeks depending on component availability. Production orders follow standard lead times of 3 to 5 weeks, with expedited scheduling available for programs requiring faster delivery.

For programs with recurring production requirements, Calpak USA offers blanket order and scheduled release programs that lock in pricing, secure component inventory, and guarantee production slots. Our supply chain team manages long-lead component procurement, safety stock planning, and last-time-buy coordination to keep your production line running without interruption. All tooling, stencils, test fixtures, and process documentation are retained between production runs, eliminating setup duplication and reducing per-unit costs at scale.

ELECTRONIC // ASSEMBLIES

Electronic Assemblies

Common Questions

Frequently Asked Questions

What types of PCB assembly does Calpak USA offer? +

Calpak USA offers prototype assembly for 1 to 100 boards with quick-turn delivery, production assembly supporting volumes up to 10 million units per year, and full turnkey assembly where we handle everything from PCB fabrication and component procurement through final test and shipping. We assemble using surface mount technology, through-hole insertion, and mixed technology processes, all to IPC Class 2 or Class 3 workmanship standards depending on your application requirements.

What is the difference between consigned and turnkey PCB assembly? +

In consigned assembly, you supply the bare boards and components, and Calpak USA performs the assembly, soldering, inspection, and testing. In turnkey assembly, Calpak USA manages the entire process — we fabricate or procure bare boards, source all components through authorized distributors, assemble the boards, and deliver finished tested units. Turnkey assembly simplifies your supply chain to a single point of contact and is ideal for customers who want to focus on design and sales rather than component procurement and logistics.

What is the typical turnaround time for prototype PCB assembly? +

Calpak USA offers quick-turn prototype assembly with turnaround times starting at 5 business days for consigned builds where all parts and boards are supplied. Turnkey prototype builds typically take 2 to 3 weeks depending on component lead times. For urgent programs, we offer expedited scheduling with priority placement on our SMT and through-hole lines. Every prototype build uses the same equipment and IPC workmanship standards as production, so your prototype results directly predict production yields.

Does Calpak USA provide PCB fabrication in addition to assembly? +

Yes. Calpak USA fabricates multi-layer printed circuit boards up to 30 layers using advanced materials including FR-4, Rogers, polyimide, and metal-core substrates. Our fabrication capabilities include controlled impedance, blind and buried vias, HDI microvias, rigid-flex construction, and heavy copper for power applications. Offering both fabrication and assembly from our Hawthorne, California facility eliminates shipping delays between vendors and ensures that bare board quality is verified before assembly begins.

What quality certifications does Calpak USA hold for manufacturing? +

Calpak USA holds AS9100 Rev. D certification for aerospace quality management, ISO 9001 certification for general quality management, ITAR registration for defense and export-controlled programs, and ANSI/ESD S20.20 certification for electrostatic discharge control. Our IPC-certified operators and inspectors assemble to J-STD-001 soldering standards in both IPC Class 2 and Class 3. These certifications are maintained through annual third-party audits and qualify Calpak USA for aerospace, defense, medical, and commercial manufacturing programs.

Can Calpak USA handle box build and systems integration? +

Yes. Calpak USA provides complete box build and systems integration services, assembling finished products that include PCB assemblies, wire harnesses, mechanical enclosures, displays, connectors, and packaging. Our team manages the full integration process from sub-assembly through final system-level functional testing. This is ideal for customers who need a single manufacturer to deliver shelf-ready or field-ready products rather than individual circuit boards.

LET'S BUILD // TOGETHER

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